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University of Copenhagen

IEEE Transactions on Components, Packaging, and Manufacturing Technology

ISSN: 2156-3950eISSN: 2156-3985
Publisher: Electronics Packaging Society
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Engineering(all)Electrical and Electronic EngineeringIndustrial and Manufacturing EngineeringMaterials Science(all)Electronic, Optical and Magnetic Materials

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

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